PRODUCTS

PRODUCTS

Waste Epoxy Molding Compound Recycling Technology Solution

Waste Epoxy Molding Compound Recycling Technology Solution

(1) Technical Principle Waste epoxy molding compound (EMC) consists mainly of silica, accounting for approximately 88%, with the remaining 12% being encapsulation compound components (resin and carbon black). This silica is spherical in shape and serves as a functional filler material, which is combined with encapsulation compound to form the molding compound. This technology uses a heat-treatment method to fully decompose the encapsulation compound components in the waste molding compound, ultimately yielding spherical silica powder as the final product.

Share:

Product Information

(2) Product Applications

Product Name

Applications

Spherical Silica Powder

Encapsulation materials, plastic fillers, refractory or insulation materials, coatings, electrical grade filler for EMC and CCL

Product Information

(2) Product Applications

Product Name

Applications

Spherical Silica Powder

Encapsulation materials, plastic fillers, refractory or insulation materials, coatings, electrical grade filler for EMC and CCL

In compliance with EU personal data protection laws, we are committed to protecting and providing you with control over your personal data. By clicking "Accept All", you allow us to place cookies to enhance your experience on this site, help us analyze site performance and usage, and enable us to deliver relevant marketing content. You can manage your cookie settings below. By clicking "Agree" you agree to the current settings. For more information, please visit the Privacy Statement.

CONFIRM