NEWS
SCROLL DOWN
Event InformationNov.23,2021
2021/11/22 Transcene won the 28th Small and Medium Enterprises Innovation Research Award
Transcene uses innovative application of purification technology, powder engineering and surface treatment technology to convert waste film glue from the semiconductor packaging industry into spherical silica products. Such spherical silica products can be used as raw materials for ceramic glazes, rubber fillers, refractory materials and coatings. Fillers have a wide range of uses. Through the ingenuity of Transcene, we have successfully solved the problem of processing waste lamination adhesives in the semiconductor packaging industry. At the same time, we have assisted the industry in increasing alternative sources of materials that do not destroy nature, established a local intravenous supply chain of spherical silica, and supplied cost-effective materials to domestic industries nearby. Transcene plays a bridging role connecting the semiconductor industry with the ceramics, coating and refractory materials industries, achieving industrial symbiosis of cross-border integration and creating a circular economy.
