2025/03/12 Transcene Corp. CEO Hsieh YaMin Invited to Speak at the Semiconductor Advanced Packaging Forum
As the global Outsourced Semiconductor Assembly and Test (OSAT) industry continues to expand rapidly, green manufacturing and low-carbon transformation have become critical trends for industrial advancement. As a leading provider of circular economy technologies, Transcene Corp. has long been dedicated to the recycling and reuse of electronic industry waste materials, maximizing resource efficiency while minimizing natural resource consumption, helping businesses build low-carbon and sustainable supply chains.
Among these innovations, the Epoxy Molding Compound (EMC) waste recycling technology offers a groundbreaking eco-friendly solution for the OSAT industry. This technology not only significantly reduces waste but also enables the recovery of high-purity spherical silica, which can be reintegrated into semiconductor manufacturing, fostering a circular economy model.
Transcene Corp. General Manager Hsieh Yamin has been invited to speak at the Semiconductor Advanced Packaging Forum – Vietnam's Path Forward, hosted by VNU Ho Chi Minh City. At the event, global scholars, industry experts, and business leaders will gather to discuss the latest developments in semiconductor packaging technology. Ms. Hsieh will share cutting-edge EMC waste recycling technologies and success stories, emphasizing the importance of international collaboration in driving industry growth. She will also engage in discussions with experts from different countries on how cross-border cooperation can accelerate industrial upgrades.
This visit not only strengthens Transcene Corp.'s collaboration with Vietnam's academic community but also lays a solid foundation for future technological partnerships and market expansion. Through ongoing international exchange, we aim to bring more innovative momentum to the industry while fostering mutually beneficial partnerships worldwide.
1. Semiconductor Advanced Packaging Forum –
Vietnam's Path Forward, Hosted by Vietnam National University Ho Chi Minh City.
2. Transcene Corp. CEO Hsieh YaMin Invited to Speak at the Semiconductor Advanced Packaging Forum –
Vietnam's Path Forward, Hosted by Vietnam National University Ho Chi Minh City.
Among these innovations, the Epoxy Molding Compound (EMC) waste recycling technology offers a groundbreaking eco-friendly solution for the OSAT industry. This technology not only significantly reduces waste but also enables the recovery of high-purity spherical silica, which can be reintegrated into semiconductor manufacturing, fostering a circular economy model.
Transcene Corp. General Manager Hsieh Yamin has been invited to speak at the Semiconductor Advanced Packaging Forum – Vietnam's Path Forward, hosted by VNU Ho Chi Minh City. At the event, global scholars, industry experts, and business leaders will gather to discuss the latest developments in semiconductor packaging technology. Ms. Hsieh will share cutting-edge EMC waste recycling technologies and success stories, emphasizing the importance of international collaboration in driving industry growth. She will also engage in discussions with experts from different countries on how cross-border cooperation can accelerate industrial upgrades.
This visit not only strengthens Transcene Corp.'s collaboration with Vietnam's academic community but also lays a solid foundation for future technological partnerships and market expansion. Through ongoing international exchange, we aim to bring more innovative momentum to the industry while fostering mutually beneficial partnerships worldwide.
1. Semiconductor Advanced Packaging Forum –
Vietnam's Path Forward, Hosted by Vietnam National University Ho Chi Minh City.
2. Transcene Corp. CEO Hsieh YaMin Invited to Speak at the Semiconductor Advanced Packaging Forum –
Vietnam's Path Forward, Hosted by Vietnam National University Ho Chi Minh City.